Side by side datacenter GPU specifications from the Flopper.io database.
| Huawei Ascend 910C | Huawei Ascend 950DT | |
|---|---|---|
| FP32 TFLOPS | 50.0 | 30.0 |
| Memory | 128 GB | 144 GB |
| Memory Bandwidth | 3.2 TB/s | 4.0 TB/s |
| TDP | 600 W | — |
| Precision | Huawei Ascend 910C peak TFLOPS (dense) | Huawei Ascend 950DT peak TFLOPS (dense) |
|---|---|---|
| FP64 | — | — |
| FP32 | 50.0 | 30.0 |
| TF32 | — | 273.0 |
| BF16 | 800.0 | 547.0 |
| FP16 | 800.0 | 547.0 |
| FP8 | — | 1034.0 |
| FP6 | — | — |
| FP4 | — | 2007.0 |
| INT8 | 1600.0 | 1034.0 |
| Huawei Ascend 910C | Huawei Ascend 950DT | |
|---|---|---|
| Architecture | Da Vinci v2 (dual-die) | Da Vinci v3 |
| Process Node | SMIC 7nm | — |
| Launch Year | 2025 | 2026 |
| Form Factor | OAM | OAM |
| Memory Type | HBM2e | HiZQ 2.0 |
| Interface Width | — | — |
| Interconnect | Unified Bus (UB) | Unified Bus 2.0 |
| TDP | 600 W | — |
| FP32 Efficiency | 0.08 TFLOPS/W | — |