Side by side datacenter GPU specifications from the Flopper.io database.
| Huawei Ascend 960 | NVIDIA GH200 144GB HBM3e | |
|---|---|---|
| FP32 TFLOPS | — | 67.0 |
| Memory | 288 GB | 144 GB |
| Memory Bandwidth | 9.6 TB/s | 4.9 TB/s |
| TDP | — | 1.0 kW |
| Precision | Huawei Ascend 960 peak TFLOPS (dense) | NVIDIA GH200 144GB HBM3e peak TFLOPS (dense) |
|---|---|---|
| FP64 | — | 34.0 |
| FP64_TC Tensor Core | — | 67.0 |
| FP32 | — | 67.0 |
| TF32 | — | 494.0 |
| BF16 | 1000.0 | 990.0 |
| FP16 | 1000.0 | 990.0 |
| FP8 | 2000.0 | 1979.0 |
| FP6 | — | — |
| FP4 | 4000.0 | — |
| INT8 | — | 1979.0 |
| Huawei Ascend 960 | NVIDIA GH200 144GB HBM3e | |
|---|---|---|
| Architecture | Da Vinci v4 (chiplet) | Hopper |
| Process Node | — | 4nm |
| Launch Year | 2027 | 2024 |
| Form Factor | OAM | Superchip |
| Memory Type | — | HBM3e |
| Interface Width | — | — |
| Interconnect | Unified Bus 2.0 | NVLink-C2C |
| TDP | — | 1.0 kW |
| FP32 Efficiency | — | 0.07 TFLOPS/W |