Side by side datacenter GPU specifications from the Flopper.io database.
| Qualcomm AI200 | Qualcomm AI250 | |
|---|---|---|
| FP32 TFLOPS | — | — |
| Memory | 768 GB | 768 GB |
| Memory Bandwidth | — | — |
| TDP | — | — |
| Precision | Qualcomm AI200 peak TFLOPS (dense) | Qualcomm AI250 peak TFLOPS (dense) |
|---|---|---|
| FP64 | — | — |
| FP32 | — | — |
| TF32 | — | — |
| BF16 | — | — |
| FP16 | — | — |
| FP8 | — | — |
| FP6 | — | — |
| FP4 | — | — |
| INT8 | — | — |
| Qualcomm AI200 | Qualcomm AI250 | |
|---|---|---|
| Architecture | Dragonfly | Dragonfly |
| Process Node | — | — |
| Launch Year | 2026 | 2027 |
| Form Factor | — | — |
| Memory Type | LPDDR5X | HBC Gen 1 |
| Interface Width | — | — |
| Interconnect | PCIe 6.0 scale-up / Ethernet with RoCE scale-out | PCIe 6.0 scale-up / Ethernet with RoCE scale-out |
| TDP | — | — |
| FP32 Efficiency | — | — |