Side by side datacenter GPU specifications from the Flopper.io database.
| Qualcomm AI200 | Qualcomm Cloud AI 100 Ultra | |
|---|---|---|
| FP32 TFLOPS | — | — |
| Memory | 768 GB | 128 GB |
| Memory Bandwidth | — | 548 GB/s |
| TDP | — | 150 W |
| Precision | Qualcomm AI200 peak TFLOPS (dense) | Qualcomm Cloud AI 100 Ultra peak TFLOPS (dense) |
|---|---|---|
| FP64 | — | — |
| FP32 | — | — |
| TF32 | — | — |
| BF16 | — | — |
| FP16 | — | — |
| FP8 | — | — |
| FP6 | — | — |
| FP4 | — | — |
| INT8 | — | 870.0 |
| Qualcomm AI200 | Qualcomm Cloud AI 100 Ultra | |
|---|---|---|
| Architecture | Dragonfly | Cloud AI 100 |
| Process Node | — | 7nm |
| Launch Year | 2026 | 2023 |
| Form Factor | — | PCIe |
| Memory Type | LPDDR5X | LPDDR4X |
| Interface Width | — | — |
| Interconnect | PCIe 6.0 scale-up / Ethernet with RoCE scale-out | — |
| TDP | — | 150 W |
| FP32 Efficiency | — | — |