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Flopper.io GPU Specification Sheet

AMD Instinct MI325X OAM

CDNA 3 OAM 2025 5nm FinFET

Overview

163.4
FP32 TFLOPS
256 GB
Memory
6.0 TB/s
Memory Bandwidth
1.0 kW
TDP

Performance Metrics

PrecisionPeak (dense)2:4 SparseBitsType
FP6481.7N/A64Standard
FP32163.4N/A32Standard
TF32653.71307.432Standard
BF161307.42614.916Standard
FP161307.42614.916Standard
FP82614.95229.88Standard
FP6—not published—Standard
FP4—not published—Standard
INT82614.95229.88Standard

Memory Specifications

Capacity
256 GB
Type
—
Bandwidth
6.0 TB/s
Interface Width
—

Power & Efficiency

TDP
1.0 kW
Max power (Flopper estimate)
~1.1 kW est.
FP32 dense TFLOPS per W of TDP
0.16 TFLOPS/W
FP16 dense TFLOPS per W of TDP
1.31 TFLOPS/W

Flopper estimate: 1000 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: AMD
Architecture: CDNA 3
Process Node: 5nm FinFET
Form Factor: OAM
Launch Year: 2025
Variant: OAM

Enterprise Features

Sparsity: Yes