AMD Instinct MI350X OAM

CDNA 4 OAM 2025 3nm/6nm

Overview

144.2

FP32 TFLOPS

288 GB

Memory

8.0 TB/s

Memory Bandwidth

1.0 kW

TDP

Performance Metrics

Precision	Peak (dense)	2:4 Sparse	Bits	Type
FP64	72.1	N/A	64	Standard
FP32	144.2	N/A	32	Standard
TF32	—	not published	—	Standard
BF16	2309.6	4619.2	16	Standard
FP16	2309.6	4619.2	16	Standard
FP8	4614.0	9227.4	8	Standard
FP6	9227.5	not published	—	Standard
FP4	9227.5	not published	4	Standard
INT8	4614.0	9227.4	8	Standard

Memory Specifications

Capacity: 288 GB
Type: —
Bandwidth: 8.0 TB/s
Interface Width: —

Power & Efficiency

TDP: 1.0 kW
Max power (Flopper estimate): ~1.1 kW est.
FP32 dense TFLOPS per W of TDP: 0.14 TFLOPS/W
FP16 dense TFLOPS per W of TDP: 2.31 TFLOPS/W

Flopper estimate: 1000 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: AMD

Architecture: CDNA 4

Process Node: 3nm/6nm

Form Factor: OAM

Launch Year: 2025

Variant: OAM

Enterprise Features

Sparsity: Yes