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Flopper.io GPU Specification Sheet

AMD MI250X 128GB

CDNA 2 OAM 2021 6nm

Overview

47.9
FP32 TFLOPS
128 GB
Memory
3.3 TB/s
Memory Bandwidth
560 W
TDP

Performance Metrics

PrecisionPeak (dense)BitsType
FP6447.964Standard
FP3247.932Standard
TF32——Standard
BF16383.016Standard
FP16383.016Standard
FP8——Standard
FP6——Standard
FP4——Standard
INT8383.08Standard
INT4383.04Standard

Memory Specifications

Capacity
128 GB
Type
—
Bandwidth
3.3 TB/s
Interface Width
—

Power & Efficiency

TDP
560 W
Max power (Flopper estimate)
~644 W est.
FP32 dense TFLOPS per W of TDP
0.09 TFLOPS/W
FP16 dense TFLOPS per W of TDP
0.68 TFLOPS/W

Flopper estimate: 560 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: AMD
Architecture: CDNA 2
Process Node: 6nm
Form Factor: OAM
Launch Year: 2021
Variant: 128GB

Enterprise Features

Sparsity: No