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Flopper.io GPU Specification Sheet

Apple M3 Pro

Apple M3 SoC 2023 3nm

Overview

7.4
FP32 TFLOPS
36 GB
Memory LPDDR5
150 GB/s
Memory Bandwidth
—
TDP

Performance Metrics

PrecisionPeak (dense)BitsType
FP64——Standard
FP327.432Standard
TF32——Standard
BF16——Standard
FP16——Standard
FP8——Standard
FP6——Standard
FP4——Standard
INT8——Standard

Memory Specifications

Capacity
36 GB
Type
LPDDR5
Bandwidth
150 GB/s
Interface Width
192-bit

Power & Efficiency

TDP
—
Max power
—
FP32 dense TFLOPS per W of TDP
—
FP16 dense TFLOPS per W of TDP
—

Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: Apple
Architecture: Apple M3
Process Node: 3nm
Form Factor: SoC
Launch Year: 2023

Enterprise Features

Sparsity: No