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Flopper.io GPU Specification Sheet

Cambricon MLU370-X8

MLUarch03 PCIe 2022 TSMC 7nm

Overview

24.0
FP32 TFLOPS
48 GB
Memory LPDDR5
614 GB/s
Memory Bandwidth
250 W
TDP

Performance Metrics

PrecisionPeak (dense)BitsType
FP64——Standard
FP3224.032Standard
TF32——Standard
BF1696.016Standard
FP1696.016Standard
FP8——Standard
FP6——Standard
FP4——Standard
INT8256.08Standard

Memory Specifications

Capacity
48 GB
Type
LPDDR5
Bandwidth
614 GB/s
Interface Width
—

Power & Efficiency

TDP
250 W
Max power (Flopper estimate)
~288 W est.
FP32 dense TFLOPS per W of TDP
0.10 TFLOPS/W
FP16 dense TFLOPS per W of TDP
0.38 TFLOPS/W

Flopper estimate: 250 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: Cambricon
Architecture: MLUarch03
Process Node: TSMC 7nm
Form Factor: PCIe
Launch Year: 2022

Interconnect

GPU-to-GPU: MLU-Link
Bandwidth: 200 GB/s direction and scope not stated by vendor