Huawei Atlas 200I A2 8 TOPS

Da Vinci Module 2023

Overview

—

FP32 TFLOPS

4 GB

Memory LPDDR4X

26 GB/s

Memory Bandwidth

21 W

TDP

Performance Metrics

Precision	Peak (dense)	Bits	Type
FP64	—	—	Standard
FP32	—	—	Standard
TF32	—	—	Standard
BF16	—	—	Standard
FP16	4.0	16	Standard
FP8	—	—	Standard
FP6	—	—	Standard
FP4	—	—	Standard
INT8	8.0	8	Standard

Memory Specifications

Capacity: 4 GB
Type: LPDDR4X
Bandwidth: 26 GB/s
Interface Width: —

Power & Efficiency

TDP: 21 W
Max power (Flopper estimate): ~24 W est.
FP32 dense TFLOPS per W of TDP: —
FP16 dense TFLOPS per W of TDP: 0.19 TFLOPS/W

Flopper estimate: 21 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: Huawei

Architecture: Da Vinci

Process Node: —

Form Factor: Module

Launch Year: 2023

Variant: 8 TOPS

Compute Engine

Da Vinci AI Core: 1