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Flopper.io GPU Specification Sheet

Intel Data Center GPU Flex Series 170 16GB

Xe HPG PCIe 2022

Overview

16.0
FP32 TFLOPS
16 GB
Memory
576 GB/s
Memory Bandwidth
150 W
TDP

Performance Metrics

PrecisionPeak (dense)BitsType
FP64——Standard
FP3216.032Standard
TF32——Standard
BF16——Standard
FP16——Standard
FP8——Standard
FP6——Standard
FP4——Standard
INT8250.08Standard

Memory Specifications

Capacity
16 GB
Type
—
Bandwidth
576 GB/s
Interface Width
—

Power & Efficiency

TDP
150 W
Max power (Flopper estimate)
~173 W est.
FP32 dense TFLOPS per W of TDP
0.11 TFLOPS/W
FP16 dense TFLOPS per W of TDP
—

Flopper estimate: 150 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: Intel
Architecture: Xe HPG
Process Node: —
Form Factor: PCIe
Launch Year: 2022
Variant: 170 16GB

Compute Engine

Xe Cores: 32