Intel Data Center GPU Max 1100 48GB

Xe-HPC PCIe 2023

Overview

22.2

FP32 TFLOPS

48 GB

Memory HBM2e

1.2 TB/s

Memory Bandwidth

300 W

TDP

Performance Metrics

Precision	Peak (dense)	Bits	Type
FP64	22.2	64	Standard
FP32	22.2	32	Standard
TF32	209.5	32	Standard
BF16	419.5	16	Standard
FP16	419.5	16	Standard
FP8	—	—	Standard
FP6	—	—	Standard
FP4	—	—	Standard
INT8	839.0	8	Standard

Memory Specifications

Capacity: 48 GB
Type: HBM2e
Bandwidth: 1.2 TB/s
Interface Width: —

Power & Efficiency

TDP: 300 W
Max power (Flopper estimate): ~345 W est.
FP32 dense TFLOPS per W of TDP: 0.07 TFLOPS/W
FP16 dense TFLOPS per W of TDP: 1.40 TFLOPS/W

Flopper estimate: 300 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: Intel

Architecture: Xe-HPC

Process Node: —

Form Factor: PCIe

Launch Year: 2023

Variant: 48GB

Compute Engine

Xe Cores: 56

Enterprise Features

Sparsity: No