Intel Gaudi 3 128GB

Gaudi 3 OAM 2024 5nm

Overview

229.0

FP32 TFLOPS

128 GB

Memory HBM2E

3.7 TB/s

Memory Bandwidth

900 W

TDP

Performance Metrics

Precision	Peak (dense)	Bits	Type
FP64	—	—	Standard
FP32	229.0	32	Standard
TF32	459.0	32	Standard
BF16	1678.0	16	Standard
FP16	459.0	16	Standard
FP8	1678.0	8	Standard
FP6	—	—	Standard
FP4	—	—	Standard
INT8	—	—	Standard

Memory Specifications

Capacity: 128 GB
Type: HBM2E
Bandwidth: 3.7 TB/s
Interface Width: —

Power & Efficiency

TDP: 900 W
Max power (Flopper estimate): ~1.0 kW est.
FP32 dense TFLOPS per W of TDP: 0.25 TFLOPS/W
FP16 dense TFLOPS per W of TDP: 0.51 TFLOPS/W

Flopper estimate: 900 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: Intel

Architecture: Gaudi 3

Process Node: 5nm

Form Factor: OAM

Launch Year: 2024

Variant: 128GB

Interconnect

GPU-to-GPU: RoCE v2 RDMA (24x 200GbE), 1200 GB/s bidirectional

Bandwidth: 1.2 TB/s direction and scope not stated by vendor

Enterprise Features

Sparsity: No