NVIDIA B300 SXM 262GB

Blackwell Ultra SXM 2025 4nm

Overview

75.0

FP32 TFLOPS

263 GB

Memory HBM3e

8.0 TB/s

Memory Bandwidth

1.4 kW

TDP

Performance Metrics

Precision	Peak (dense)	2:4 Sparse	Bits	Type
FP64	1.3	N/A	64	Standard
FP32	75.0	N/A	32	Standard
TF32	1125.0	2250.0	32	Standard
BF16	2250.0	4500.0	16	Standard
FP16	2250.0	4500.0	16	Standard
FP8	4500.0	9000.0	8	Standard
FP6	4500.0	9000.0	—	Standard
FP4	13500.0	18000.0	4	Standard
INT8	187.5	375.0	8	Standard

Memory Specifications

Capacity: 263 GB
Type: HBM3e
Bandwidth: 8.0 TB/s
Interface Width: —

Power & Efficiency

TDP: 1.4 kW
Max power (Flopper estimate): ~1.6 kW est.
FP32 dense TFLOPS per W of TDP: 0.05 TFLOPS/W
FP16 dense TFLOPS per W of TDP: 1.61 TFLOPS/W

Flopper estimate: 1400 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: NVIDIA

Architecture: Blackwell Ultra

Process Node: 4nm

Form Factor: SXM

Launch Year: 2025

Variant: SXM 262GB

Enterprise Features

Sparsity: Yes