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Flopper.io GPU Specification Sheet

NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip 252GB

Blackwell Ultra Superchip 2025 4nm

Overview

80.0
FP32 TFLOPS
252 GB
Memory HBM3e
7.1 TB/s
Memory Bandwidth
—
TDP

Performance Metrics

PrecisionPeak (dense)2:4 SparseBitsType
FP641.3N/A64Standard
FP3280.0N/A32Standard
TF321250.02500.032Standard
BF162500.05000.016Standard
FP162500.05000.016Standard
FP85000.010000.08Standard
FP65000.010000.0—Standard
FP415000.020000.04Standard
INT8165.0330.08Standard

Memory Specifications

Capacity
252 GB
Type
HBM3e
Bandwidth
7.1 TB/s
Interface Width
—

Power & Efficiency

TDP
—
Max power
—
FP32 dense TFLOPS per W of TDP
—
FP16 dense TFLOPS per W of TDP
—

Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: NVIDIA
Architecture: Blackwell Ultra
Process Node: 4nm
Form Factor: Superchip
Launch Year: 2025
Variant: Grace Blackwell Ultra Desktop Superchip 252GB

Interconnect

GPU-to-GPU: NVLink-C2C
Bandwidth: 900 GB/s bidirectional, per GPU

Enterprise Features

Sparsity: Yes