NVIDIA GH200 144GB HBM3e

Hopper Superchip 2024 4nm

Overview

67.0

FP32 TFLOPS

144 GB

Memory HBM3e

4.9 TB/s

Memory Bandwidth

1.0 kW

TDP

Performance Metrics

Precision	Peak (dense)	2:4 Sparse	Bits	Type
FP64	34.0	N/A	64	Standard
FP64 Tensor	67.0	N/A	64	Tensor Core
FP32	67.0	N/A	32	Standard
TF32	494.0	989.0	32	Standard
BF16	990.0	1979.0	16	Standard
FP16	990.0	1979.0	16	Standard
FP8	1979.0	3958.0	8	Standard
FP6	—	not published	—	Standard
FP4	—	not published	—	Standard
INT8	1979.0	3958.0	8	Standard

Memory Specifications

Capacity: 144 GB
Type: HBM3e
Bandwidth: 4.9 TB/s
Interface Width: —

Power & Efficiency

TDP: 1.0 kW
Max power (Flopper estimate): ~1.1 kW est.
FP32 dense TFLOPS per W of TDP: 0.07 TFLOPS/W
FP16 dense TFLOPS per W of TDP: 0.99 TFLOPS/W

Flopper estimate: 1000 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: NVIDIA

Architecture: Hopper

Process Node: 4nm

Form Factor: Superchip

Launch Year: 2024

Variant: 144GB HBM3e

Interconnect

GPU-to-GPU: NVLink-C2C

Bandwidth: 900 GB/s bidirectional, per GPU

Enterprise Features

Sparsity: Yes