Flopper.io
Flopper.io GPU Specification Sheet

Qualcomm AI200

Dragonfly 2026

Overview

FP32 TFLOPS
768 GB
VRAM LPDDR5X
Memory Bandwidth
TDP

Performance Metrics

PrecisionPeak TFLOPSBitsType

Memory Specifications

Capacity
768 GB
Type
LPDDR5X
Bandwidth
Interface Width

Power & Efficiency

TDP
Est. Max Power
FP32 Efficiency
FP16 Efficiency

Hardware Details

Vendor: Qualcomm
Architecture: Dragonfly
Process Node:
Form Factor:
Launch Year: 2026

Interconnect

GPU-to-GPU: PCIe 6.0 scale-up / Ethernet with RoCE scale-out