Flopper.io GPU Specification Sheet
October 9, 2026
flopper.io/gpu/qualcomm-ai250Qualcomm AI250
Dragonfly 2027
Overview
—
FP32 TFLOPS
768 GB
Memory HBC Gen 1
—
Memory Bandwidth
—
TDP
Performance Metrics
| Precision | Peak (dense) | Bits | Type |
|---|---|---|---|
| FP64 | — | — | Standard |
| FP32 | — | — | Standard |
| TF32 | — | — | Standard |
| BF16 | — | — | Standard |
| FP16 | — | — | Standard |
| FP8 | — | — | Standard |
| FP6 | — | — | Standard |
| FP4 | — | — | Standard |
| INT8 | — | — | Standard |
Memory Specifications
- Capacity
- 768 GB
- Type
- HBC Gen 1
- Bandwidth
- —
- Interface Width
- —
Power & Efficiency
- TDP
- —
- Max power
- —
- FP32 dense TFLOPS per W of TDP
- —
- FP16 dense TFLOPS per W of TDP
- —
Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.
Hardware Details
Vendor: Qualcomm
Architecture: Dragonfly
Process Node: —
Form Factor: —
Launch Year: 2027
Interconnect
GPU-to-GPU: PCIe 6.0 scale-up / Ethernet with RoCE scale-out