Flopper.io GPU Specification Sheet

August 11, 2026

flopper.io/gpu/qualcomm-ai250

Qualcomm AI250

Dragonfly 2027

Overview

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FP32 TFLOPS

768 GB

VRAM HBC Gen 1

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Memory Bandwidth

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TDP

Performance Metrics

Precision	Peak TFLOPS	Bits	Type

Memory Specifications

Capacity: 768 GB
Type: HBC Gen 1
Bandwidth: —
Interface Width: —

Power & Efficiency

TDP: —
Est. Max Power: —
FP32 Efficiency: —
FP16 Efficiency: —

Hardware Details

Vendor: Qualcomm

Architecture: Dragonfly

Process Node: —

Form Factor: —

Launch Year: 2027

Interconnect

GPU-to-GPU: PCIe 6.0 scale-up / Ethernet with RoCE scale-out