Flopper.io
Flopper.io System Specification Sheet

AMD Instinct MI300X Platform

8x Instinct MI300X CDNA 3 baseboard 2023

Overview

20,919
FP8 TFLOPS Dense
1.5 TB
Aggregate Memory
42.4 TB/s
Aggregate Bandwidth
6.0 kW
Aggregate Power

Performance Metrics

PrecisionPeak (TFLOPS)Per GPU (TFLOPS)TFLOPS/W
FP6465482—
FP321,307163—
TF325,230654—
FP1610,4591,307—
BF1610,4591,307—
FP820,9192,615—
INT820,9192,615—

All figures are dense. Vendors commonly headline the sparse number, which is twice the dense one.

Configuration

Accelerator
Instinct MI300X 192GB
Count
8
Memory per GPU
192 GB
Bandwidth per GPU
5.3 TB/s

Power & Efficiency

Aggregate Power
6.0 kW
TDP per GPU
750 W
FP8 Efficiency
3.49 TFLOPS/W
Aggregate Bandwidth
42.4 TB/s

System Details

Vendor: AMD
Family: Instinct Platform
Architecture: CDNA 3
Form Factor: baseboard
Release Year: 2023
Process Node: 5nm FinFET

Interconnect

4th Gen AMD Infinity Fabric, eight fully connected OAM modules on an OCP UBB 2.0 baseboard, 7x 128 GB/s links per GPU, 896 GB/s ring-of-8 aggregate

Notes

AMD's eight-GPU building block for CDNA 3, integrating eight MI300X OAM modules on an industry-standard OCP universal baseboard (UBB 2.0), each linked to the other seven over 128 GB/s Infinity Fabric links for 896 GB/s of aggregate ring bandwidth, plus one PCIe Gen 5 x16 host link per GPU. AMD's platform datasheet gives 1.5 TB of HBM3 (stored as 8 x 192 GB = 1.536 TB) and 5.3 TB/s per GPU, so 42.4 TB/s across the board, with a 750 W maximum board power per GPU (6.0 kW for the eight GPUs, not counting the host). Compute: 2,432 compute units, 155,648 stream processors at up to 2,100 MHz. AMD sells it through solution partners rather than directly. Precision figures are eight times the per-GPU MI300X row, which AMD's one-decimal platform figures round, except FP32 and FP64, where AMD's platform figures are printed more precisely and are stored as printed.