| Precision | Peak (PFLOPS) | Per GPU (TFLOPS) | TFLOPS/W |
|---|---|---|---|
| FP64 | 0.0 | 1.3 | — |
| FP32 | 0.6 | 75.0 | — |
| TF32 | 9.0 | 1125.0 | — |
| FP16 | 18.0 | 2250.0 | — |
| BF16 | 18.0 | 2250.0 | — |
| FP8 | 36.0 | 4500.0 | — |
| FP4 | 108.0 | 13500.0 | — |
| FP6 | 36.0 | 4500.0 | — |
All figures are dense. Vendors commonly headline the sparse number, which is twice the dense one.
NVLink 5.0 / NVSwitch 4.0 across the HGX B300 baseboard; 4x FHHL PCIe Gen5 x16 slots for fabric, NIC or DPU
The eight-way XD685 in its NVIDIA HGX B300 configuration, which requires the high-power liquid-cooled chassis S6Y07A rather than the standard DLC one. This is the denser sibling of the air-cooled XD690, which reaches the same eight Blackwell Ultra GPUs in 10U where this does it in 5U. Two fifth-generation AMD EPYC processors, 24 DIMM slots and up to 6 TB of DDR5-6400, eight EDSFF NVMe E3.S drives. HPE publishes no system power draw for the XD685, only twelve 3,000 W Titanium supplies with ten deployable, so unlike the XD690 no figure is recorded; the compute shown is NVIDIA's specification for the HGX B300 baseboard rather than an HPE claim.