Flopper.io
Flopper.io GPU Specification Sheet

AMD Radeon RX 7900 GRE 16GB

RDNA 3 PCIe 2023 5nm

Overview

46.0
FP32 TFLOPS
16 GB
Memory GDDR6
576 GB/s
Memory Bandwidth
260 W
TDP

Performance Metrics

PrecisionPeak (dense)BitsType
FP64——Standard
FP3246.032Standard
TF32——Standard
BF16——Standard
FP1692.016Standard
FP8——Standard
FP6——Standard
FP4——Standard
INT892.08Standard
INT4184.04Standard

Memory Specifications

Capacity
16 GB
Type
GDDR6
Bandwidth
576 GB/s
Interface Width
256-bit

Power & Efficiency

TDP
260 W
Max power
260 W
FP32 dense TFLOPS per W of TDP
0.18 TFLOPS/W
FP16 dense TFLOPS per W of TDP
0.35 TFLOPS/W

Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: AMD
Architecture: RDNA 3
Process Node: 5nm
Form Factor: PCIe
Launch Year: 2023
Variant: 16GB

Compute Engine

Stream Processors: 5,120
Tensor Cores: 160 (RDNA 3)
CUs: 80
Boost Clock: 2.25 GHz

Interconnect

PCIe: Gen 4 x16

Chip Design

Transistors: 54.0 billion

Enterprise Features

Sparsity: No