Flopper.io
Flopper.io GPU Specification Sheet

Biren BR100

Vendor claimed Biren SPC OAM 2022 TSMC 7nm

Overview

256.0
FP32 TFLOPS
64 GB
VRAM HBM2E
1.6 TB/s
Memory Bandwidth
550 W
TDP

Performance Metrics

PrecisionPeak TFLOPSBitsType
INT82048.08Standard
BF161024.016Standard
TF32512.032Standard
FP32256.032Standard

Memory Specifications

Capacity
64 GB
Type
HBM2E
Bandwidth
1.6 TB/s
Interface Width

Power & Efficiency

TDP
550 W
Est. Max Power
633 W
FP32 Efficiency
0.47 TFLOPS/W
FP16 Efficiency

Hardware Details

Vendor: Biren
Architecture: Biren SPC
Process Node: TSMC 7nm
Form Factor: OAM
Launch Year: 2022

Interconnect

GPU-to-GPU: BLink
Bandwidth: 2.3 TB/s