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per.io
GPU Specification Sheet
June 16, 2026
flopper.io/gpu/biren-br100
Biren BR100
Vendor claimed
Biren SPC
OAM
2022
TSMC 7nm
Overview
256.0
FP32 TFLOPS
64 GB
VRAM HBM2E
1.6 TB/s
Memory Bandwidth
550 W
TDP
Performance Metrics
Precision
Peak TFLOPS
Bits
Type
INT8
2048.0
8
Standard
BF16
1024.0
16
Standard
TF32
512.0
32
Standard
FP32
256.0
32
Standard
Memory Specifications
Capacity
64 GB
Type
HBM2E
Bandwidth
1.6 TB/s
Interface Width
—
Power & Efficiency
TDP
550 W
Est. Max Power
633 W
FP32 Efficiency
0.47 TFLOPS/W
FP16 Efficiency
—
Hardware Details
Vendor:
Biren
Architecture:
Biren SPC
Process Node:
TSMC 7nm
Form Factor:
OAM
Launch Year:
2022
Interconnect
GPU-to-GPU:
BLink
Bandwidth:
2.3 TB/s