Biren BR100

Biren SPC OAM 2022 TSMC 7nm

Overview

256.0

FP32 TFLOPS

64 GB

Memory HBM2E

1.6 TB/s

Memory Bandwidth

550 W

TDP

Performance Metrics

Precision	Peak (dense)	Bits	Type
FP64	—	—	Standard
FP32	256.0	32	Standard
TF32	512.0	32	Standard
BF16	1024.0	16	Standard
FP16	—	—	Standard
FP8	—	—	Standard
FP6	—	—	Standard
FP4	—	—	Standard
INT8	2048.0	8	Standard

Memory Specifications

Capacity: 64 GB
Type: HBM2E
Bandwidth: 1.6 TB/s
Interface Width: —

Power & Efficiency

TDP: 550 W
Max power (Flopper estimate): ~633 W est.
FP32 dense TFLOPS per W of TDP: 0.47 TFLOPS/W
FP16 dense TFLOPS per W of TDP: —

Flopper estimate: 550 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: Biren

Architecture: Biren SPC

Process Node: TSMC 7nm

Form Factor: OAM

Launch Year: 2022

Interconnect

GPU-to-GPU: BLink

Bandwidth: 2.3 TB/s direction and scope not stated by vendor