BI
Biren BR100
Vendor claimed
Biren SPC OAM 2022 TSMC 7nm
FP32
256.0
TFLOPS
VRAM
64 GB
HBM2E
TDP
550 W
465.5 TFLOPS/kW
Bandwidth
1.6 TB/s
memory
Performance Metrics
Peak theoretical throughput by precision type
| Precision | Description | Bits | Peak TFLOPS | Efficiency |
|---|---|---|---|---|
| INT8 | 8-bit integer | 8 | 2048.0 | 3.724 TFLOPS/W |
| BF16 | Brain Float 16 | 16 | 1024.0 | 1.862 TFLOPS/W |
| TF32 | TensorFloat-32 | 32 | 512.0 | 0.931 TFLOPS/W |
| FP32 | 32-bit floating point | 32 | 256.0 | 0.465 TFLOPS/W |
FP32 Efficiency
0.465 TFLOPS/W
256.0 TFLOPS / 550W
Power Specifications
TDP
550 W
Max Power
633 W
Power Connector
PCIe 16-pin
Cooling
Air
Memory Specifications
Capacity
64 GB
Type
HBM2E
Bandwidth
1600 GB/s
Interface
--
Hardware & Design
Form Factor
OAM
Architecture
Biren SPC
Process Node
TSMC 7nm
Launch Year
2022
Variant
Standard
Market Segment
Data Center
Full Specifications
| Memory | |
|---|---|
| VRAM | 64 GB |
| Memory Type | HBM2E |
| Bandwidth | 1.6 TB/s |
| Interconnect & I/O | |
| GPU-to-GPU | BLink |
| Interconnect Bandwidth | 2.3 TB/s |
| Power & Thermal | |
| TDP | 550 W |
| General | |
| Form Factor | OAM |
| Architecture | Biren SPC |
| Launch Year | 2022 |
Documentation & Resources
Common Use Cases
General Compute AI/ML Workloads Data Processing
The Biren BR100 is optimized for high-performance computing tasks with Biren SPC architecture delivering 256 TFLOPS of compute power.
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