Flopper.io GPU Specification Sheet
September 26, 2026
flopper.io/gpu/huawei-ascend-310Huawei Ascend 310
Da Vinci SoC 2018 12nm
Overview
—
FP32 TFLOPS
—
Memory LPDDR4X
—
Memory Bandwidth
8 W
TDP
Performance Metrics
| Precision | Peak (dense) | Bits | Type |
|---|---|---|---|
| FP64 | — | — | Standard |
| FP32 | — | — | Standard |
| TF32 | — | — | Standard |
| BF16 | — | — | Standard |
| FP16 | 8.0 | 16 | Standard |
| FP8 | — | — | Standard |
| FP6 | — | — | Standard |
| FP4 | — | — | Standard |
| INT8 | 16.0 | 8 | Standard |
Memory Specifications
- Capacity
- —
- Type
- LPDDR4X
- Bandwidth
- —
- Interface Width
- 128-bit
Power & Efficiency
- TDP
- 8 W
- Max power
- 8 W
- FP32 dense TFLOPS per W of TDP
- —
- FP16 dense TFLOPS per W of TDP
- 1.00 TFLOPS/W
Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.
Hardware Details
Vendor: Huawei
Architecture: Da Vinci
Process Node: 12nm
Form Factor: SoC
Launch Year: 2018
Compute Engine
Da Vinci AI Core: 2
Interconnect
PCIe: 3.0 x4
Chip Design
Die Size: 104 mm²