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Flopper.io GPU Specification Sheet

Huawei Ascend 910A

Da Vinci OAM 2019 TSMC 7nm

Overview

16.0
FP32 TFLOPS
32 GB
VRAM HBM2
1.2 TB/s
Memory Bandwidth
310 W
TDP

Performance Metrics

PrecisionPeak TFLOPSBitsType
INT8512.08Standard
FP16256.016Standard
FP3216.032Standard

Memory Specifications

Capacity
32 GB
Type
HBM2
Bandwidth
1.2 TB/s
Interface Width

Power & Efficiency

TDP
310 W
Est. Max Power
357 W
FP32 Efficiency
0.05 TFLOPS/W
FP16 Efficiency
0.83 TFLOPS/W

Hardware Details

Vendor: Huawei
Architecture: Da Vinci
Process Node: TSMC 7nm
Form Factor: OAM
Launch Year: 2019

Interconnect

GPU-to-GPU: HCCS
Bandwidth: 90 GB/s