Flopper.io
Flopper.io GPU Specification Sheet

Huawei Ascend 910B

Da Vinci v2 OAM 2024 SMIC 7nm

Overview

FP32 TFLOPS
64 GB
VRAM HBM2e
1.6 TB/s
Memory Bandwidth
400 W
TDP

Performance Metrics

PrecisionPeak TFLOPSBitsType
INT8800.08Standard
FP16400.016Standard
BF16400.016Standard

Memory Specifications

Capacity
64 GB
Type
HBM2e
Bandwidth
1.6 TB/s
Interface Width

Power & Efficiency

TDP
400 W
Est. Max Power
460 W
FP32 Efficiency
FP16 Efficiency
1.00 TFLOPS/W

Hardware Details

Vendor: Huawei
Architecture: Da Vinci v2
Process Node: SMIC 7nm
Form Factor: OAM
Launch Year: 2024

Interconnect

GPU-to-GPU: HCCS
Bandwidth: 392 GB/s