Flopper.io GPU Specification Sheet
September 25, 2026
flopper.io/gpu/huawei-ascend-910bHuawei Ascend 910B
Da Vinci v2 OAM 2024 SMIC 7nm
Overview
—
FP32 TFLOPS
64 GB
Memory HBM2e
1.6 TB/s
Memory Bandwidth
400 W
TDP
Performance Metrics
| Precision | Peak (dense) | Bits | Type |
|---|---|---|---|
| FP64 | — | — | Standard |
| FP32 | — | — | Standard |
| TF32 | — | — | Standard |
| BF16 | 400.0 | 16 | Standard |
| FP16 | 400.0 | 16 | Standard |
| FP8 | — | — | Standard |
| FP6 | — | — | Standard |
| FP4 | — | — | Standard |
| INT8 | 800.0 | 8 | Standard |
Memory Specifications
- Capacity
- 64 GB
- Type
- HBM2e
- Bandwidth
- 1.6 TB/s
- Interface Width
- —
Power & Efficiency
- TDP
- 400 W
- Max power (Flopper estimate)
- ~460 W est.
- FP32 dense TFLOPS per W of TDP
- —
- FP16 dense TFLOPS per W of TDP
- 1.00 TFLOPS/W
Flopper estimate: 400 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.
Hardware Details
Vendor: Huawei
Architecture: Da Vinci v2
Process Node: SMIC 7nm
Form Factor: OAM
Launch Year: 2024
Interconnect
GPU-to-GPU: HCCS
Bandwidth: 392 GB/s direction and scope not stated by vendor