Flopper.io GPU Specification Sheet
June 13, 2026
flopper.io/gpu/huawei-ascend-910cHuawei Ascend 910C
Da Vinci v2 (dual-die) OAM 2025 SMIC 7nm
Overview
50.0
FP32 TFLOPS
128 GB
VRAM HBM2e
3.2 TB/s
Memory Bandwidth
600 W
TDP
Performance Metrics
| Precision | Peak TFLOPS | Bits | Type |
|---|---|---|---|
| INT8 | 1600.0 | 8 | Standard |
| FP16 | 800.0 | 16 | Standard |
| BF16 | 780.0 | 16 | Standard |
| FP32 | 50.0 | 32 | Standard |
Memory Specifications
- Capacity
- 128 GB
- Type
- HBM2e
- Bandwidth
- 3.2 TB/s
- Interface Width
- —
Power & Efficiency
- TDP
- 600 W
- Est. Max Power
- 690 W
- FP32 Efficiency
- 0.08 TFLOPS/W
- FP16 Efficiency
- 1.33 TFLOPS/W
Hardware Details
Vendor: Huawei
Architecture: Da Vinci v2 (dual-die)
Process Node: SMIC 7nm
Form Factor: OAM
Launch Year: 2025
Interconnect
GPU-to-GPU: Unified Bus (UB)
Bandwidth: 350 GB/s