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Flopper.io GPU Specification Sheet

Huawei Ascend 950DT

Da Vinci v3 OAM 2026

Overview

FP32 TFLOPS
144 GB
VRAM HiZQ 2.0
4.0 TB/s
Memory Bandwidth
TDP

Performance Metrics

PrecisionPeak TFLOPSBitsType
FP81000.08Standard
FP42000.04Standard
FP16500.016Standard
BF16500.016Standard

Memory Specifications

Capacity
144 GB
Type
HiZQ 2.0
Bandwidth
4.0 TB/s
Interface Width

Power & Efficiency

TDP
Est. Max Power
FP32 Efficiency
FP16 Efficiency

Hardware Details

Vendor: Huawei
Architecture: Da Vinci v3
Process Node:
Form Factor: OAM
Launch Year: 2026

Interconnect

GPU-to-GPU: Unified Bus 2.0
Bandwidth: 2.0 TB/s