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Huawei Ascend 950DT

Type: NPUArchitecture: Da Vinci v3Form factor: OAMReleased: 2026Spec confidence: Official
FP8 (dense)
1,034
TFLOPS
FP32
30
TFLOPS
Memory
144 GB
HiZQ 2.0
Bandwidth
4.0 TB/s
memory

Overview

The Ascend 950DT is Huawei's decode-and-training oriented member of the Ascend 950 generation, and the chip behind both the air-cooled Atlas 650E server and the liquid-cooled Atlas 950 SuperPoD. Huawei publishes it in three bins by Cube Core count — 36, 32 or 28 cores, with twice as many Vector Cores in each case — giving 2,007, 1,784 or 1,561 TFLOPS of MXFP4, 1,034/919/804 TFLOPS of HiF8, MXFP8 and FP8, the same figures again as INT8 TOPS, 547/486/425 TFLOPS of BF16 and FP16, and 273/243/212 TFLOPS of TF32. The figures here are the top bin, matching the 144 GB configuration; memory comes in either 144 GB or 96 GB at 4 TB/s, and both are real shipping configurations, which is why the Atlas 650E and Atlas 950 SuperPoD both specify 96 GB while this chip is listed at 144. The bins are visible in Huawei's own products: the air-cooled Atlas 650E works out at exactly the lowest bin on all three of its published precisions, while the Atlas 950 SuperPoD's "up to 2 EFLOPS mxFP4" across 1,024 cards is the top bin rounded down. Beyond the tensor units the chip carries 128 MB of L2 cache with sector and cache-hint support, a Linx816 AI CPU subsystem, eighteen Unified Bus ports at 112 Gbps for 2,016 GB/s bidirectional, two 400 Gbps UBoE ports shared with those, and PCIe 5.0 x16. Huawei labels none of these figures dense or sparse and publishes no sparse rate.

Performance

Peak theoretical throughput by precision type

PrecisionPeak
FP64
No verified data available
FP32
32-bit floating point
30TFLOPS
TF32
TensorFloat-32
273TFLOPS
BF16
Brain Float 16
547TFLOPS
FP16
16-bit floating point
547TFLOPS
FP8
8-bit floating point
1,034TFLOPS
FP6
No verified data available
FP4
4-bit floating point
2,007TFLOPS
INT8
8-bit integer
1,034TOPS

Specifications

Architecture

Da Vinci v3

Form Factor

OAM

Launch Year

2026

Process Node

No verified data available

Memory

144 GB HiZQ 2.0

Bandwidth

4,000 GB/s

TDP

No verified data available

Max power

No verified data available

Interconnect

2.0 TB/s Unified Bus 2.0

direction and scope not stated by vendor

Cube Core

36

Spec Confidence

Official

Full Specifications

Compute Engine
Cube Core 36
Memory
Memory 144 GB
Memory Type HiZQ 2.0
Bandwidth 4.0 TB/s
Interface Width No verified data available
Interconnect & I/O
GPU-to-GPU Unified Bus 2.0
Interconnect Bandwidth 2.0 TB/s direction and scope not stated by vendor
PCIe 5.0 x16
Cache
L2 Cache 128 MB
Power & Thermal
TDP No verified data available
Max power No verified data available
General
Form Factor OAM
Architecture Da Vinci v3
Process Node No verified data available
Launch Year 2026

Datasheet & Resources

Data Provenance

Every figure traced to a source

Primary Source

Publisher
Tom's Hardware
Published
2025-09-19

Data Quality

Spec confidence
Official
Clock basis
Boost
Core precisions with figures
7 of 9
Normalization
All values in TFLOPS

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Systems Using This GPU

Pre-configured systems featuring the Huawei Ascend 950DT

SystemGPU CountPeak PerformanceTotal Power
Huawei Atlas 650E
Atlas · rack · 2026
8x Ascend 950DT 12.5 PFLOPS 14.5 kW View System
Huawei Atlas 950 SuperPoD
Atlas · pod · 2026
1024x Ascend 950DT 2.00 EFLOPS No verified data available View System

Frequently Asked Questions

How many TFLOPS does the Huawei Ascend 950DT have?

The Huawei Ascend 950DT delivers 30 TFLOPS FP32, 547 TFLOPS FP16 and 1,034 TFLOPS FP8 at peak.

What is the power consumption of the Huawei Ascend 950DT?

Flopper does not currently have a verified TDP (Thermal Design Power) figure for the Huawei Ascend 950DT.

How much memory does the Huawei Ascend 950DT have?

The Huawei Ascend 950DT is equipped with 144 GB of memory with 4,000 GB/s of memory bandwidth.

What architecture is the Huawei Ascend 950DT based on?

The Huawei Ascend 950DT is based on the Da Vinci v3 architecture, launched in 2026.

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