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Flopper.io GPU Specification Sheet

Huawei Ascend 950PR

Da Vinci v3 OAM 2026

Overview

FP32 TFLOPS
128 GB
VRAM HiBL 1.0
1.6 TB/s
Memory Bandwidth
900 W
TDP

Performance Metrics

PrecisionPeak TFLOPSBitsType
FP81000.08Standard
FP42000.04Standard
FP16500.016Standard
BF16500.016Standard

Memory Specifications

Capacity
128 GB
Type
HiBL 1.0
Bandwidth
1.6 TB/s
Interface Width

Power & Efficiency

TDP
900 W
Est. Max Power
1.0 kW
FP32 Efficiency
FP16 Efficiency
0.56 TFLOPS/W

Hardware Details

Vendor: Huawei
Architecture: Da Vinci v3
Process Node:
Form Factor: OAM
Launch Year: 2026

Interconnect

GPU-to-GPU: Unified Bus 2.0
Bandwidth: 2.0 TB/s