Flopper.io
Flopper.io GPU Specification Sheet

Huawei Ascend 960

Da Vinci v4 (chiplet) OAM 2027

Overview

FP32 TFLOPS
288 GB
VRAM
9.6 TB/s
Memory Bandwidth
TDP

Performance Metrics

PrecisionPeak TFLOPSBitsType
FP82000.08Standard
FP44000.04Standard
FP161000.016Standard
BF161000.016Standard

Memory Specifications

Capacity
288 GB
Type
Bandwidth
9.6 TB/s
Interface Width

Power & Efficiency

TDP
Est. Max Power
FP32 Efficiency
FP16 Efficiency

Hardware Details

Vendor: Huawei
Architecture: Da Vinci v4 (chiplet)
Process Node:
Form Factor: OAM
Launch Year: 2027

Interconnect

GPU-to-GPU: Unified Bus 2.0
Bandwidth: 2.2 TB/s