Flopper.io GPU Specification Sheet
September 26, 2026
flopper.io/gpu/huawei-ascend-960Huawei Ascend 960
Da Vinci v4 (chiplet) OAM 2027
Overview
—
FP32 TFLOPS
288 GB
Memory
9.6 TB/s
Memory Bandwidth
—
TDP
Performance Metrics
| Precision | Peak (dense) | Bits | Type |
|---|---|---|---|
| FP64 | — | — | Standard |
| FP32 | — | — | Standard |
| TF32 | — | — | Standard |
| BF16 | 1000.0 | 16 | Standard |
| FP16 | 1000.0 | 16 | Standard |
| FP8 | 2000.0 | 8 | Standard |
| FP6 | — | — | Standard |
| FP4 | 4000.0 | 4 | Standard |
| INT8 | — | — | Standard |
Memory Specifications
- Capacity
- 288 GB
- Type
- —
- Bandwidth
- 9.6 TB/s
- Interface Width
- —
Power & Efficiency
- TDP
- —
- Max power
- —
- FP32 dense TFLOPS per W of TDP
- —
- FP16 dense TFLOPS per W of TDP
- —
Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.
Hardware Details
Vendor: Huawei
Architecture: Da Vinci v4 (chiplet)
Process Node: —
Form Factor: OAM
Launch Year: 2027
Interconnect
GPU-to-GPU: Unified Bus 2.0
Bandwidth: 2.2 TB/s direction and scope not stated by vendor