Flopper.io GPU Specification Sheet
September 26, 2026
flopper.io/gpu/huawei-ascend-970Huawei Ascend 970
Da Vinci v5 OAM 2028
Overview
—
FP32 TFLOPS
288 GB
Memory
14.4 TB/s
Memory Bandwidth
—
TDP
Performance Metrics
| Precision | Peak (dense) | Bits | Type |
|---|---|---|---|
| FP64 | — | — | Standard |
| FP32 | — | — | Standard |
| TF32 | — | — | Standard |
| BF16 | 2000.0 | 16 | Standard |
| FP16 | 2000.0 | 16 | Standard |
| FP8 | 4000.0 | 8 | Standard |
| FP6 | — | — | Standard |
| FP4 | 8000.0 | 4 | Standard |
| INT8 | — | — | Standard |
Memory Specifications
- Capacity
- 288 GB
- Type
- —
- Bandwidth
- 14.4 TB/s
- Interface Width
- —
Power & Efficiency
- TDP
- —
- Max power
- —
- FP32 dense TFLOPS per W of TDP
- —
- FP16 dense TFLOPS per W of TDP
- —
Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.
Hardware Details
Vendor: Huawei
Architecture: Da Vinci v5
Process Node: —
Form Factor: OAM
Launch Year: 2028
Interconnect
GPU-to-GPU: Unified Bus 3.0
Bandwidth: 4.0 TB/s direction and scope not stated by vendor