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Flopper.io GPU Specification Sheet

Huawei Ascend 970

Da Vinci v5 OAM 2028

Overview

FP32 TFLOPS
288 GB
VRAM
14.4 TB/s
Memory Bandwidth
TDP

Performance Metrics

PrecisionPeak TFLOPSBitsType
FP84000.08Standard
FP48000.04Standard
FP162000.016Standard
BF162000.016Standard

Memory Specifications

Capacity
288 GB
Type
Bandwidth
14.4 TB/s
Interface Width

Power & Efficiency

TDP
Est. Max Power
FP32 Efficiency
FP16 Efficiency

Hardware Details

Vendor: Huawei
Architecture: Da Vinci v5
Process Node:
Form Factor: OAM
Launch Year: 2028

Interconnect

GPU-to-GPU: Unified Bus 3.0
Bandwidth: 4.0 TB/s