Flopper.io
Flopper.io GPU Specification Sheet

Huawei Atlas 300V

Da Vinci PCIe 2022

Overview

—
FP32 TFLOPS
24 GB
Memory LPDDR4X
205 GB/s
Memory Bandwidth
72 W
TDP

Performance Metrics

PrecisionPeak (dense)BitsType
FP64——Standard
FP32——Standard
TF32——Standard
BF16——Standard
FP1650.016Standard
FP8——Standard
FP6——Standard
FP4——Standard
INT8100.08Standard

Memory Specifications

Capacity
24 GB
Type
LPDDR4X
Bandwidth
205 GB/s
Interface Width
—

Power & Efficiency

TDP
72 W
Max power (Flopper estimate)
~83 W est.
FP32 dense TFLOPS per W of TDP
—
FP16 dense TFLOPS per W of TDP
0.69 TFLOPS/W

Flopper estimate: 72 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: Huawei
Architecture: Da Vinci
Process Node: —
Form Factor: PCIe
Launch Year: 2022

Interconnect

PCIe: 4.0 x16

Chip Design

Chiplets: 1

Enterprise Features

ECC: Yes