Flopper.io GPU Specification Sheet
October 9, 2026
flopper.io/gpu/microsoft-maia-200Microsoft Maia 200
Maia 200 Custom 2026 TSMC N3
Overview
—
FP32 TFLOPS
216 GB
Memory HBM3e
7.0 TB/s
Memory Bandwidth
750 W
TDP
Performance Metrics
| Precision | Peak (dense) | Bits | Type |
|---|---|---|---|
| FP64 | — | — | Standard |
| FP32 | — | — | Standard |
| TF32 | — | — | Standard |
| BF16 | 1262.5 | 16 | Standard |
| FP16 | — | — | Standard |
| FP8 | 5050.0 | 8 | Standard |
| FP6 | — | — | Standard |
| FP4 | 10100.0 | 4 | Standard |
| INT8 | — | — | Standard |
Memory Specifications
- Capacity
- 216 GB
- Type
- HBM3e
- Bandwidth
- 7.0 TB/s
- Interface Width
- —
Power & Efficiency
- TDP
- 750 W
- Max power (Flopper estimate)
- ~862 W est.
- FP32 dense TFLOPS per W of TDP
- —
- FP16 dense TFLOPS per W of TDP
- —
Flopper estimate: 750 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.
Hardware Details
Vendor: Microsoft
Architecture: Maia 200
Process Node: TSMC N3
Form Factor: Custom
Launch Year: 2026
Interconnect
GPU-to-GPU: Ethernet scale-up (Maia AI Transport Layer)
Bandwidth: 2.8 TB/s direction and scope not stated by vendor
Chip Design
Transistors: 140.0 billion