Flopper.io
Flopper.io GPU Specification Sheet

Microsoft Maia 200

Maia 200 Custom 2026 TSMC N3

Overview

FP32 TFLOPS
216 GB
VRAM HBM3e
7.0 TB/s
Memory Bandwidth
750 W
TDP

Performance Metrics

PrecisionPeak TFLOPSBitsType
FP85050.08Standard
FP410100.04Standard
BF161262.516Standard

Memory Specifications

Capacity
216 GB
Type
HBM3e
Bandwidth
7.0 TB/s
Interface Width

Power & Efficiency

TDP
750 W
Est. Max Power
862 W
FP32 Efficiency
FP16 Efficiency

Hardware Details

Vendor: Microsoft
Architecture: Maia 200
Process Node: TSMC N3
Form Factor: Custom
Launch Year: 2026

Interconnect

GPU-to-GPU: Ethernet scale-up (Maia AI Transport Layer)
Bandwidth: 2.8 TB/s

Chip Design

Transistors: 140.0 billion