Flopper.io
Flopper.io GPU Specification Sheet

OpenAI Jalapeño

Jalapeño Custom 2026

Overview

—
FP32 TFLOPS
216 GB
Memory HBM4
15.4 TB/s
Memory Bandwidth
700 W
TDP

Performance Metrics

PrecisionPeak (dense)BitsType
FP64——Standard
FP32——Standard
TF32——Standard
BF16—16Standard
FP16——Standard
FP83400.08Standard
FP6——Standard
FP413400.04Standard
INT8——Standard

Memory Specifications

Capacity
216 GB
Type
HBM4
Bandwidth
15.4 TB/s
Interface Width
—

Power & Efficiency

TDP
700 W
Max power (Flopper estimate)
~805 W est.
FP32 dense TFLOPS per W of TDP
—
FP16 dense TFLOPS per W of TDP
—

Flopper estimate: 700 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: OpenAI
Architecture: Jalapeño
Process Node: —
Form Factor: Custom
Launch Year: 2026

Interconnect

GPU-to-GPU: Ethernet scale-up (Broadcom Tomahawk 6)
Bandwidth: 600 GB/s direction and scope not stated by vendor

Chip Design

Chiplets: 2 (1 compute die + 1 IO chiplet)