Flopper.io
Flopper.io GPU Specification Sheet

Qualcomm Cloud AI 100 Ultra

Cloud AI 100 PCIe 2023 7nm

Overview

FP32 TFLOPS
128 GB
VRAM LPDDR4X
548 GB/s
Memory Bandwidth
150 W
TDP

Performance Metrics

PrecisionPeak TFLOPSBitsType
INT8870.08Standard

Memory Specifications

Capacity
128 GB
Type
LPDDR4X
Bandwidth
548 GB/s
Interface Width

Power & Efficiency

TDP
150 W
Est. Max Power
173 W
FP32 Efficiency
FP16 Efficiency

Hardware Details

Vendor: Qualcomm
Architecture: Cloud AI 100
Process Node: 7nm
Form Factor: PCIe
Launch Year: 2023

Compute Engine

AI Cores: 64

Interconnect

PCIe: Gen4 x16

Enterprise Features

ECC: Yes