Shipping and rentable today, which makes it the only Qualcomm data center accelerator you can actually obtain. That is worth stating plainly because Qualcomm's newer and far more widely covered Dragonfly parts are not: the AI200 has not shipped, the AI250 is not expected to begin commercial sampling before mid-2027, and Qualcomm has published no throughput figure of any kind for either. This older 7 nm card is the opposite on both counts, with a full Qualcomm product brief behind it and published INT8 and FP16 performance. Cirrascale rents it in eight-card servers on its AI Innovation Cloud with public monthly pricing, and also runs a separate Qualcomm inference service on the same silicon. Note that Qualcomm does not label these performance figures as dense or sparse anywhere; they are recorded here as dense, on the reasoning set out in this entry's data provenance.
Qualcomm logo

Qualcomm Cloud AI 100 Ultra

Type: ASICArchitecture: Cloud AI 100Form factor: PCIeReleased: 2023Process: 7nmSpec confidence: Official
Memory
128 GB
LPDDR4X
Bandwidth
548 GB/s
memory
TDP
150 W

Overview

Qualcomm Cloud AI 100 Ultra is the largest card in Qualcomm's first data center AI family, a 150 watt PCIe inference accelerator built on a 7 nm process and aimed squarely at generative AI serving economics rather than at peak throughput. It carries 64 AI cores on a single card and Qualcomm's product brief rates it at up to 870 INT8 TOPS, which is the only compute figure that brief publishes. An FP16 rating of 288 TFLOPS appears in our records, attributed to a Qualcomm product page spec table, but that page has since moved and now renders only through JavaScript, so the figure could not be re-verified and is deliberately not listed among the precisions below. Its most distinctive feature is memory hierarchy rather than raw compute: each AI core owns 9 megabytes of software-managed on-die SRAM for 576 megabytes in total, by far the largest local scratchpad of any conventional accelerator, backed by 128 GB of error-corrected LPDDR4x delivering 548 GB/s. The design accepts an order of magnitude less DRAM bandwidth than an HBM part in exchange for capacity, cost and a power envelope low enough that eight cards fit comfortably in a single server, and Qualcomm markets the result on performance per dollar, claiming a 100 billion parameter generative model runs on one card and that a single server holds models eight times larger than competing solutions allow. The card is a full-height three-quarter-length PCIe form factor on a Gen 4 sixteen-lane host interface, with no accelerator-to-accelerator fabric of any kind, so scaling is done over PCIe and the host network rather than over a proprietary link. Four sibling SKUs share the same core at lower core counts and clocks, from a 16-core 75 watt entry card upward, and Qualcomm's own footnote that each AI core holds 9 MB of SRAM reconciles every variant's memory figure exactly, confirming they are bins of one design. Qualcomm publishes throughput for only these two datatypes and no clock speed, die size or transistor count for any member of the family. Commercially this part matters more than its age suggests: Qualcomm's successor Dragonfly line, announced in October 2025 as the rack-scale AI200 and AI250, has published no performance figures at all and is not yet available, leaving the Cloud AI 100 Ultra as the Qualcomm accelerator that ships, that has a real product brief, and that can be rented today through Cirrascale.

Performance

Peak theoretical throughput by precision type

PrecisionPeak
FP64
No verified data available
FP32
No verified data available
TF32
No verified data available
BF16
No verified data available
FP16
No verified data available
FP8
No verified data available
FP6
No verified data available
FP4
No verified data available
INT8
8-bit integer
870TOPS

Specifications

Architecture

Cloud AI 100

Form Factor

PCIe

Launch Year

2023

Process Node

7nm

Memory

128 GB LPDDR4X

Bandwidth

548 GB/s

TDP

150 W

Max power (Flopper estimate)

~173 W est. Flopper estimate: 150 W TDP x 1.15. The vendor publishes no maximum board power for this part.

AI Cores

64

Spec Confidence

Official

Full Specifications

Compute Engine
AI Cores 64
Memory
Memory 128 GB
Memory Type LPDDR4X
Bandwidth 548 GB/s
Interface Width No verified data available
On-Die SRAM 576 MB
Interconnect & I/O
PCIe Gen4 x16
Power & Thermal
TDP 150 W
Max power (Flopper estimate) ~173 W est.
Enterprise Features
ECC Memory Yes
Physical & Media
Card Length 237.9 mm
General
Form Factor PCIe
Architecture Cloud AI 100
Process Node 7nm
Launch Year 2023

Datasheet & Resources

Data Provenance

Every figure traced to a source

Primary Source

Publisher
Qualcomm
Published
No verified data available

Data Quality

Spec confidence
Official
Clock basis
Boost
Core precisions with figures
1 of 9
Normalization
All values in TFLOPS

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Frequently Asked Questions

How many TFLOPS does the Qualcomm Cloud AI 100 Ultra have?

The verified peak figures Flopper holds for the Qualcomm Cloud AI 100 Ultra are 870 TOPS INT8. Flopper does not currently have verified FP32, FP16 and FP8 throughput figures for it.

What is the power consumption of the Qualcomm Cloud AI 100 Ultra?

The Qualcomm Cloud AI 100 Ultra has a TDP (Thermal Design Power) rating of 150 watts.

How much memory does the Qualcomm Cloud AI 100 Ultra have?

The Qualcomm Cloud AI 100 Ultra is equipped with 128 GB of memory with 548 GB/s of memory bandwidth.

What architecture is the Qualcomm Cloud AI 100 Ultra based on?

The Qualcomm Cloud AI 100 Ultra is based on the Cloud AI 100 architecture, launched in 2023.

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