Flopper.io
Flopper.io GPU Specification Sheet

T-Head Zhenwu 810E

Zhenwu 2026

Overview

—
FP32 TFLOPS
96 GB
Memory HBM2e
2.7 TB/s
Memory Bandwidth
—
TDP

Performance Metrics

PrecisionPeak (dense)BitsType
FP64——Standard
FP32——Standard
TF32——Standard
BF16——Standard
FP16——Standard
FP8——Standard
FP6——Standard
FP4——Standard
INT8——Standard

Memory Specifications

Capacity
96 GB
Type
HBM2e
Bandwidth
2.7 TB/s
Interface Width
—

Power & Efficiency

TDP
—
Max power
—
FP32 dense TFLOPS per W of TDP
—
FP16 dense TFLOPS per W of TDP
—

Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: T-Head
Architecture: Zhenwu
Process Node: —
Form Factor: —
Launch Year: 2026

Interconnect

GPU-to-GPU: ICN
Bandwidth: 700 GB/s direction and scope not stated by vendor
Links: 7