T-Head Zhenwu 810E NEW
Overview
The Zhenwu 810E is the first Alibaba AI accelerator the company put a name and a product page to, on 29 January 2026, although it had been shipping inside Alibaba Cloud for a year before that under the internal label PPU. It pairs 96 GB of HBM2e at 2.7 TB/s with seven independent ICN ports carrying 700 GB/s of inter-chip bandwidth, and it is the part that proved the architecture at scale: Alibaba says it runs several clusters of more than ten thousand cards, and that more than 100,000 of them serve autonomous driving customers on Alibaba Cloud alone. What the specification cannot tell you is how fast it is. T-Head publishes no TFLOPS or TOPS figure for this chip, names no datatype on its product page, and positions it only by comparison, claiming overall performance above the NVIDIA A800 and level with the NVIDIA H20. It is not sold as a component. The only way to use one is to rent Alibaba Cloud capacity.
Performance
Peak theoretical throughput by precision type
| Precision | Peak |
|---|---|
FP64 | No verified data available |
FP32 | No verified data available |
TF32 | No verified data available |
BF16 | No verified data available |
FP16 | No verified data available |
FP8 | No verified data available |
FP6 | No verified data available |
FP4 | No verified data available |
INT8 | No verified data available |
Flopper holds no verified throughput figures for this part yet. The rows stay so the gaps are visible.
Specifications
Architecture
Zhenwu
Form Factor
No verified data available
Launch Year
2026
Process Node
No verified data available
Memory
96 GB HBM2e
Bandwidth
2,700 GB/s
TDP
No verified data available
Max power
No verified data available
Interconnect
700 GB/s ICN
direction and scope not stated by vendor
Spec Confidence
Official
Full Specifications
| Memory | |
|---|---|
| Memory | 96 GB |
| Memory Type | HBM2e |
| Bandwidth | 2.7 TB/s |
| Interface Width | No verified data available |
| Interconnect & I/O | |
| GPU-to-GPU | ICN |
| Interconnect Bandwidth | 700 GB/s direction and scope not stated by vendor |
| Interconnect Links | 7 |
| Power & Thermal | |
| TDP | No verified data available |
| Max power | No verified data available |
| General | |
| Form Factor | No verified data available |
| Architecture | Zhenwu |
| Process Node | No verified data available |
| Launch Year | 2026 |
Datasheet & Resources
Flopper Datasheet
T-Head Zhenwu 810E specifications, generated from our database. Printable.
Zhenwu 810E product page (T-Head)
T-Head · Latest version
Data Provenance
Every figure traced to a source
Primary Source
- Document
- Zhenwu 810E product page (T-Head)
- Publisher
- T-Head
- Published
- No verified data available
Data Quality
- Spec confidence
- Official
- Core precisions with figures
- 0 of 9
- Normalization
- All values in TFLOPS
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Frequently Asked Questions
How many TFLOPS does the T-Head Zhenwu 810E have?
Flopper does not currently have any verified throughput figures for the T-Head Zhenwu 810E.
What is the power consumption of the T-Head Zhenwu 810E?
Flopper does not currently have a verified TDP (Thermal Design Power) figure for the T-Head Zhenwu 810E.
How much memory does the T-Head Zhenwu 810E have?
The T-Head Zhenwu 810E is equipped with 96 GB of memory with 2,700 GB/s of memory bandwidth.
What architecture is the T-Head Zhenwu 810E based on?
The T-Head Zhenwu 810E is based on the Zhenwu architecture, launched in 2026.
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