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Flopper.io System Specification Sheet

Huawei Atlas 950 SuperPoD

1024x Ascend 950DT Da Vinci v3 pod 2026

Overview

1,000
FP8 PFLOPS Dense
98.3 TB
Aggregate Memory
4096.0 TB/s
Aggregate Bandwidth
100.0 kW
Aggregate Power

Performance Metrics

PrecisionPeak (PFLOPS)Per GPU (TFLOPS)TFLOPS/W
FP81000.0976.6
FP42000.01953.1

All figures are dense. Vendors commonly headline the sparse number, which is twice the dense one.

Configuration

Accelerator
Ascend 950DT
Count
1024
Memory per GPU
144 GB
Bandwidth per GPU
4.0 TB/s

Power & Efficiency

Aggregate Power
100.0 kW
TDP per GPU
FP8 Efficiency
10.00 TFLOPS/W
Aggregate Bandwidth
4096.0 TB/s

System Details

Vendor: Huawei
Family: Atlas
Architecture: Da Vinci v3
Form Factor: pod
Release Year: 2026
Process Node:

Interconnect

UnifiedBus 2.0 (Lingqu) all-optical, 1.72 PB/s aggregate scale-up, 64 x 1.68 TB/s bidirectional per cabinet

Notes

Huawei's current product specification: 16 compute cabinets plus 4 UnifiedBus interconnect cabinets (44OU each), up to 1,024 Ascend 950DT, 1,024 x 96 GB on-chip memory at 4.0 TB/s, 1 EFLOPS mxFP8/FP8/HiF8 and 2 EFLOPS mxFP4, 1.72 PB/s total scale-up bandwidth, 256 TB globally addressable memory, 100 kW, fully liquid cooled. Offered in 64-card and 1,024-card configurations. Huawei's HC2025 keynote of 18 September 2025 described an 8,192-card configuration delivering 8 EFLOPS FP8 and 16 EFLOPS FP4; that figure does not appear in the current product table and is recorded here for reference. Huawei states no dense or sparse basis for any of these figures.