Inventec Artemis III Rack

System Details

Interconnect

NVLink across all 72 GPUs with nine 1RU non-scalable NVLink switch trays; back-end is a ConnectX-9 SuperNIC on every carrier board at 1.6 Tb/s InfiniBand, front-end a BlueField-4 DPU at 800 Gb/s

Notes

Inventec's Vera Rubin rack, and a step change in density: 228 kW of TDP for the NVL72 building blocks, against 125 kW for its GB200 rack and 136 kW for its GB300 one. Delivering that needs a busbar rated above 5,000 A and 3RU power shelves rated at 110 kW apiece, each holding six 18.3 kW supplies plus bulk capacitance, and 100 percent liquid cooling across both compute and switch trays. The configuration is eighteen 1U compute trays and nine 1U non-scalable NVLink switch trays in a 48RU MGX rack. Networking moves again, to a ConnectX-9 SuperNIC on every carrier board at 1.6 Tb/s InfiniBand for the back end and a BlueField-4 DPU at 800 Gb/s for the front, with four E1.S NVMe devices for local storage. The rack measures 600 by 2236 by 1200 mm, rolling to 2296 mm. The 110 kW power shelf figure is supply capacity and is distinct from the 228 kW draw. No throughput or memory figures are published.