Inventec Artemis III Rack
Inventec's Vera Rubin rack, and a step change in density: 228 kW of TDP for the NVL72 building blocks, against 125 kW for its GB200 rack and 136 kW for its GB300 one. Delivering that needs a busbar rated above 5,000 A and 3RU power shelves rated at 110 kW apiece, each holding six 18.3 kW supplies plus bulk capacitance, and 100 percent liquid cooling across both compute and switch trays. The configuration is eighteen 1U compute trays and nine 1U non-scalable NVLink switch trays in a 48RU MGX rack. Networking moves again, to a ConnectX-9 SuperNIC on every carrier board at 1.6 Tb/s InfiniBand for the back end and a BlueField-4 DPU at 800 Gb/s for the front, with four E1.S NVMe devices for local storage. The rack measures 600 by 2236 by 1200 mm, rolling to 2296 mm. The 110 kW power shelf figure is supply capacity and is distinct from the 228 kW draw. No throughput or memory figures are published.
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Systems built on this design
1 configurationBuilt on the NVIDIA Vera Rubin NVL72 baseboard, so accelerator performance matches the reference. Chassis, CPU, memory and cooling are this vendor's own.
System Details
GPU Configuration
System Specifications
Powered by NVIDIA Rubin
This system utilizes 72 × NVIDIA Rubin SXM GPUs, each delivering exceptional performance for AI and HPC workloads.
Per GPU TDP
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Per GPU Memory
288 GB
Process Node
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Architecture
Rubin
Documentation & Resources
Official Datasheet
Inventec Artemis III Rack technical specifications
Inventec Artemis Rack
Inventec • Latest version
Typical Use Cases
The Inventec Artemis III Rack runs 72× Rubin GPUs over NVLink across all 72 GPUs with nine 1RU non-scalable NVLink switch trays; back-end is a ConnectX-9 SuperNIC on every carrier board at 1.6 Tb/s InfiniBand, front-end a BlueField-4 DPU at 800 Gb/s.