Flopper.io
Flopper.io GPU Specification Sheet

Cerebras WSE-3

Wafer Scale Engine 3 Wafer-Scale 2024 TSMC 5nm

Overview

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FP32 TFLOPS
—
Memory On-die SRAM
—
Memory Bandwidth
—
TDP

Performance Metrics

PrecisionPeak (dense)BitsType
FP64——Standard
FP32——Standard
TF32——Standard
BF16——Standard
FP16——Standard
FP8——Standard
FP6——Standard
FP4——Standard
INT8——Standard

Memory Specifications

Capacity
—
Type
On-die SRAM
Bandwidth
—
Interface Width
—

Power & Efficiency

TDP
—
Max power
—
FP32 dense TFLOPS per W of TDP
—
FP16 dense TFLOPS per W of TDP
—

Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: Cerebras
Architecture: Wafer Scale Engine 3
Process Node: TSMC 5nm
Form Factor: Wafer-Scale
Launch Year: 2024

Compute Engine

Sparse linear algebra core: 900,000

Chip Design

Transistors: 4000.0 billion
Die Size: 46225 mm²