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Flopper.io GPU Specification Sheet

Huawei Atlas 200I A2 20 TOPS

Da Vinci Module 2023

Overview

—
FP32 TFLOPS
12 GB
Memory LPDDR4X
51 GB/s
Memory Bandwidth
25 W
TDP

Performance Metrics

PrecisionPeak (dense)BitsType
FP64——Standard
FP32——Standard
TF32——Standard
BF16——Standard
FP1610.016Standard
FP8——Standard
FP6——Standard
FP4——Standard
INT820.08Standard

Memory Specifications

Capacity
12 GB
Type
LPDDR4X
Bandwidth
51 GB/s
Interface Width
—

Power & Efficiency

TDP
25 W
Max power (Flopper estimate)
~29 W est.
FP32 dense TFLOPS per W of TDP
—
FP16 dense TFLOPS per W of TDP
0.40 TFLOPS/W

Flopper estimate: 25 W TDP x 1.15. The vendor publishes no maximum board power for this part. Per W of TDP figures divide dense peak by accelerator TDP. Board power only: excludes host CPUs, networking, cooling and facility overhead.

Hardware Details

Vendor: Huawei
Architecture: Da Vinci
Process Node: —
Form Factor: Module
Launch Year: 2023
Variant: 20 TOPS

Compute Engine

Da Vinci AI Core: 1
Boost Clock: 1.22 GHz