ASUS ESC NB8-E11 vs Fujitsu PRIMERGY GX2570 M8s (Liquid-Cooled)

Both are built on the NVIDIA HGX B200 8-GPU baseboard, so their accelerator performance is identical rather than merely similar. The choice between them is chassis, cooling, expansion and supplier, not FLOPS.

What actually differs

Specification	ASUS ESC NB8-E11	Fujitsu PRIMERGY GX2570 M8s (Liquid-Cooled)
Vendor	ASUS	Fujitsu
Part number	—	GX2570 M8s
Form factor	rack	rack
Released	—	—
Accelerator	8x B200	8x B200
Aggregate memory	1.4 TB	1.4 TB
Aggregate bandwidth	64.0 TB/s	—
System power	—	—
Interconnect	NVIDIA NVLink with NVSwitch, 1,800 GB/s GPU-to-GPU; one-GPU-to-one-NIC topology with up to 8 NICs	One NVIDIA HGX B200 8-GPU baseboard with NVSwitch interconnecting the eight B200 SXM modules; two 10GbE RJ45 ports on an Intel X710, with Ethernet and InfiniBand cards optional

Rows shown in grey are identical between the two.

ASUS ESC NB8-E11

A 10U eight-GPU server built on the NVIDIA Blackwell HGX B200 baseboard, with dual 5th generation Intel Xeon Scalable processors at 350 W and NVLink giving 1,800 GB/s directly between GPUs, twice the bandwidth of the Hopper-generation ESC N8-E11. It uses a dedicated one-GPU-to-one-NIC topology supporting up to eight NICs, and offers up to 11 PCIe slots, 32 DIMM slots, 10 NVMe bays and dual 10Gb LAN, with 5+1 80 PLUS Titanium supplies. Unlike many B200 platforms it is air-cooled, using dedicated CPU and GPU airflow tunnels, which is what accounts for the 10U height. ASUS publishes no FLOPS figure of its own, so the compute shown is NVIDIA's for the HGX B200 baseboard, including the sparse figures NVIDIA publishes for Blackwell. ASUS's detailed specification tab does not render server-side, so chassis dimensions, weight and power supply wattages could not be read and are deliberately absent.

Vendor product page

Fujitsu PRIMERGY GX2570 M8s (Liquid-Cooled)

The liquid-cooled member of Fujitsu's PRIMERGY GX2570 M8s pair, and the same NVIDIA HGX B200 8-GPU baseboard as the air-cooled model compressed from 10U into 4U. Eight B200 SXM modules at 180 GB apiece are interconnected by NVSwitch for 1.44 TB of GPU memory, hosted by two Intel Xeon 6900P processors with 24 DIMM slots taking up to 6 TB. Liquid cooling costs two of the ten NVMe bays, leaving eight, and the chassis measures 449 by 895.4 by 174 mm at up to 80 kg with rails, which is 53 kg lighter than the air-cooled build. Power comes from four 6,600 W Titanium supplies in 2+2 redundancy. Fujitsu notes that a CDU, manifolds and a liquid-cooling rack must be purchased separately. No throughput figure and no system power draw are published; baseboard performance is on the linked HGX B200 entry.