Fujitsu PRIMERGY GX2570 M8s (Liquid-Cooled) vs HPE ProLiant Compute XD685 (HGX B200)
Both are built on the NVIDIA HGX B200 8-GPU baseboard, so their accelerator performance is identical rather than merely similar. The choice between them is chassis, cooling, expansion and supplier, not FLOPS.
What actually differs
| Specification | Fujitsu PRIMERGY GX2570 M8s (Liquid-Cooled) | HPE ProLiant Compute XD685 (HGX B200) |
|---|---|---|
| Vendor | Fujitsu | HPE |
| Part number | GX2570 M8s | S4R96A |
| Form factor | rack | rack |
| Released | — | 2025 |
| Accelerator | 8x B200 | 8x B200 |
| Aggregate memory | 1.4 TB | 1.4 TB |
| Aggregate bandwidth | — | 64.0 TB/s |
| System power | — | — |
| Interconnect | One NVIDIA HGX B200 8-GPU baseboard with NVSwitch interconnecting the eight B200 SXM modules; two 10GbE RJ45 ports on an Intel X710, with Ethernet and InfiniBand cards optional | NVLink 5.0 / NVSwitch 4.0 across the HGX B200 baseboard; 4x FHHL PCIe Gen5 x16 slots for fabric, NIC or DPU |
Rows shown in grey are identical between the two.
Fujitsu PRIMERGY GX2570 M8s (Liquid-Cooled)
The liquid-cooled member of Fujitsu's PRIMERGY GX2570 M8s pair, and the same NVIDIA HGX B200 8-GPU baseboard as the air-cooled model compressed from 10U into 4U. Eight B200 SXM modules at 180 GB apiece are interconnected by NVSwitch for 1.44 TB of GPU memory, hosted by two Intel Xeon 6900P processors with 24 DIMM slots taking up to 6 TB. Liquid cooling costs two of the ten NVMe bays, leaving eight, and the chassis measures 449 by 895.4 by 174 mm at up to 80 kg with rails, which is 53 kg lighter than the air-cooled build. Power comes from four 6,600 W Titanium supplies in 2+2 redundancy. Fujitsu notes that a CDU, manifolds and a liquid-cooling rack must be purchased separately. No throughput figure and no system power draw are published; baseboard performance is on the linked HGX B200 entry.
Vendor product pageHPE ProLiant Compute XD685 (HGX B200)
The eight-way XD685 in its NVIDIA HGX B200 configuration, liquid cooled only, in the 5U DLC chassis S4R96A. HPE names B200 support twice in the QuickSpecs, in the supported-accelerator list and in the rule that the H200 and B200 liquid-cooled accelerators must be paired with this chassis, so the configuration is not in doubt. The accelerator kit part number is not recorded: the accelerator table lists two entries both described as HGX B300 with different part numbers, one of which is likely the B200 mislabelled, and guessing which would put an unverified number on a row buyers may quote. Two fifth-generation AMD EPYC processors, 24 DIMM slots and up to 6 TB of DDR5-6400. HPE publishes no system power draw, only twelve 3,000 W supplies, so nothing is summed; compute is NVIDIA's for the baseboard.
Vendor product page