Fujitsu PRIMERGY GX2570 M8s (Liquid-Cooled) vs Inventec P9000G6 (LC)
Both are built on the NVIDIA HGX B200 8-GPU baseboard, so their accelerator performance is identical rather than merely similar. The choice between them is chassis, cooling, expansion and supplier, not FLOPS.
What actually differs
| Specification | Fujitsu PRIMERGY GX2570 M8s (Liquid-Cooled) | Inventec P9000G6 (LC) |
|---|---|---|
| Vendor | Fujitsu | Inventec |
| Part number | GX2570 M8s | P9000G6 (LC) |
| Form factor | rack | rack |
| Released | — | — |
| Accelerator | 8x B200 | 8x B200 |
| Aggregate memory | 1.4 TB | — |
| Aggregate bandwidth | — | — |
| System power | — | — |
| Interconnect | One NVIDIA HGX B200 8-GPU baseboard with NVSwitch interconnecting the eight B200 SXM modules; two 10GbE RJ45 ports on an Intel X710, with Ethernet and InfiniBand cards optional | One NVIDIA HGX B200 liquid-cooled baseboard; eight low-profile PCIe Gen5 x16 slots from the switch |
Rows shown in grey are identical between the two.
Fujitsu PRIMERGY GX2570 M8s (Liquid-Cooled)
The liquid-cooled member of Fujitsu's PRIMERGY GX2570 M8s pair, and the same NVIDIA HGX B200 8-GPU baseboard as the air-cooled model compressed from 10U into 4U. Eight B200 SXM modules at 180 GB apiece are interconnected by NVSwitch for 1.44 TB of GPU memory, hosted by two Intel Xeon 6900P processors with 24 DIMM slots taking up to 6 TB. Liquid cooling costs two of the ten NVMe bays, leaving eight, and the chassis measures 449 by 895.4 by 174 mm at up to 80 kg with rails, which is 53 kg lighter than the air-cooled build. Power comes from four 6,600 W Titanium supplies in 2+2 redundancy. Fujitsu notes that a CDU, manifolds and a liquid-cooling rack must be purchased separately. No throughput figure and no system power draw are published; baseboard performance is on the linked HGX B200 entry.
Vendor product pageInventec P9000G6 (LC)
The liquid-cooled Blackwell node in Inventec's range, an 8U chassis 448 by 352 by 850 mm carrying one NVIDIA HGX B200 baseboard with fourth or fifth generation Intel Xeon Scalable processors of up to 385 W. Liquid cooling saves two rack units against the air-cooled P9000AG7 and cuts the GPU fan count from fifteen to five. Storage and expansion match the air-cooled machine at eight U.2 NVMe bays from the switch, four more from the CPU, two M.2 and eight low-profile PCIe Gen5 x16 slots. Power is 3,300 W 54 V supplies in 3+3 redundancy with a 2,400 W 12 V host plane. Inventec publishes no throughput, memory or system power figure; the linked HGX B200 entry carries NVIDIA's. The GPU count is not stated and follows from NVIDIA's designation of HGX B200 as an eight-GPU baseboard.
Vendor product page