Gigabyte G593-SD1-LAX3 vs HPE ProLiant Compute XD685 (HGX H200)
Both are built on the NVIDIA HGX H200 baseboard, so their accelerator performance is identical rather than merely similar. The choice between them is chassis, cooling, expansion and supplier, not FLOPS.
What actually differs
| Specification | Gigabyte G593-SD1-LAX3 | HPE ProLiant Compute XD685 (HGX H200) |
|---|---|---|
| Vendor | Gigabyte | HPE |
| Part number | 6NG593SD1DR000LBX3 | — |
| Form factor | rack | rack |
| Released | 2024 | 2025 |
| Accelerator | 8x H200 | 8x H200 |
| Aggregate memory | 1.1 TB | 1.1 TB |
| Aggregate bandwidth | 38.4 TB/s | 38.4 TB/s |
| System power | — | — |
| Interconnect | NVIDIA NVLink with NVSwitch, 900 GB/s GPU-to-GPU | NVLink 4.0 / NVSwitch 3.0 across the HGX H200 baseboard; 4x FHHL PCIe Gen5 x16 slots for fabric, NIC or DPU |
Rows shown in grey are identical between the two.
Gigabyte G593-SD1-LAX3
A 5U direct-liquid-cooled server carrying the NVIDIA HGX H200 baseboard with eight SXM GPUs, connected at 900 GB/s by NVLink and NVSwitch. Both CPUs and GPUs are liquid cooled, which is what lets Gigabyte fit the platform into 5U rather than the 8U an air-cooled equivalent needs. Two LGA 4677 sockets take 5th or 4th generation Intel Xeon Scalable processors or the Xeon CPU Max series, with 32 DIMM slots across eight DDR5 channels, eight Gen5 NVMe bays, twelve PCIe Gen5 x16 slots and BlueField-3 DPU compatibility. Power comes from four plus two redundant 3000 W Titanium supplies. It weighs 91 kg net and orders as 6NG593SD1DR000LBX3. Note that Gigabyte's page quotes "over 32 petaflops of FP8 deep learning compute" for an eight-way HGX H200; that is NVIDIA's own marketing figure for the baseboard rather than a Gigabyte measurement, and it is the sparse number. The dense figures shown here are NVIDIA's for the same baseboard, and they are what this site publishes throughout.
Vendor product pageHPE ProLiant Compute XD685 (HGX H200)
The eight-way XD685 in its NVIDIA HGX H200 configuration, the only one of the four HPE offers in both air-cooled and liquid-cooled form: 6U for air with accelerator kit S3P89A, 5U for direct liquid cooling with S4X53A. Two fifth-generation AMD EPYC processors drive it, from 32 to 96 cores and 280 to 400 W, across 24 DIMM slots with twelve channels per socket and up to 6 TB of DDR5-6400. Storage is eight EDSFF NVMe E3.S drives, or twelve with a storage controller, plus RAID-1 M.2 boot. No chassis part number is recorded because two apply depending on cooling, S4Q28A for air and S4R96A for liquid. HPE publishes no system power draw for the XD685, only twelve 3,000 W Titanium supplies with ten deployable, so nothing is summed here; the compute figures are NVIDIA's for the HGX H200 baseboard rather than an HPE claim.
Vendor product page