Ingrasys GB6181I vs Intel Gaudi 3 HLB-325 Baseboard
Accelerator configuration, aggregate memory, bandwidth and power, side by side.
Specifications
| Specification | Ingrasys GB6181I | Intel Gaudi 3 HLB-325 Baseboard |
|---|---|---|
| Vendor | Ingrasys | Intel |
| Part number | GB6181I | HLB-325 |
| Form factor | rack | baseboard |
| Released | — | 2024 |
| Accelerator | 8x Gaudi 3 | 8x Gaudi 3 |
| Aggregate memory | — | 1.0 TB |
| Aggregate bandwidth | — | — |
| System power | — | 7.6 kW |
| Interconnect | Eight Gaudi 3 accelerators on a universal baseboard, with twenty PCIe 5.0 x16 slots available for scale-out networking | Direct all-to-all between the eight accelerators at 4.2 TB/s bidirectional with no switching IC, plus 1.2 TB/s bidirectional scale-out over 6 OSFP connectors as 24x 200 Gbps RDMA (RoCE v2); host attach is 8x PCIe Gen 5.0 x16 |
Rows shown in grey are identical between the two.
Ingrasys GB6181I
Ingrasys' Gaudi node, and the second Intel accelerator system in this catalogue. Eight Gaudi 3 accelerators sit on a universal baseboard in a six OpenU liquid-cooled chassis, so like its AMD sibling this is an Open Compute part rather than a 19 inch one. What stands out against the rest of the field is the I/O: thirty-two NVMe drive bays and twenty PCIe 5.0 x16 slots, far more than the eight to twelve typical of an eight-accelerator machine, which suits Gaudi's design of scaling out over ordinary Ethernet rather than a proprietary fabric. Power is ten 3,000 W Platinum supplies in 5+5 redundancy, which is capacity rather than draw, so no system power is shown. Ingrasys publishes no throughput figure; per-accelerator compute is on the Gaudi 3 chip entry and the baseboard's figures on the linked Intel HLB-325 entry.
Vendor product pageIntel Gaudi 3 HLB-325 Baseboard
Intel's eight-accelerator universal baseboard for Gaudi 3, and the unit Intel offers OEMs to build servers around. It carries eight HL-325L OAM mezzanine cards and connects them all-to-all at 4.2 TB/s bidirectional without a switching chip, which is the design's distinguishing choice: scale-up needs no switch silicon, and scale-out runs over standard Ethernet at 1.2 TB/s through six OSFP connectors rather than a proprietary fabric. Intel rates the whole assembly at 7.6 kW including the eight OAMs, draws it from a 54 V main input with 12 V standby, and sizes the board at 417 by 585 mm to drop into 19-inch server designs. Sold either as the bare HLB-325 or, as the HLFB-325L, pre-populated with eight cards and tested as one subsystem. Intel publishes no aggregate throughput figure for the baseboard, so none is shown: per-accelerator compute is on the Gaudi 3 chip entry, sourced to Table 5 of Intel's technical paper. Total memory of 1.024 TB is the eight cards' published 128 GB apiece.
Vendor product page