AS
ASUS Ascent GX10 Double Stack Bundle
Pairs two Ascent GX10 units via ConnectX-7 to deliver 256 GB unified memory and 2,000 TFLOPS FP4. Doubles the single-unit capacity for larger model inference and multi-GPU fine-tuning on the desktop.
Grace Blackwell Architecture · 256GB Unified Memory · 2.0K TOPS
Grace Blackwell Q2 2025 Unified Memory NVIDIA DGX OS
Product Image
Coming Soon
AI Performance
2.0K
TOPS
Memory
256GB
LPDDR5x
Max Model
405B
parameters
Networking
200
Gbps
Full Specifications
| Architecture & Compute | |
|---|---|
| Architecture | Grace Blackwell |
| SoC Model | GB10 |
| GPU Architecture | NVIDIA Blackwell |
| Tensor Cores | 5th Generation |
| RT Cores | 4th Generation |
| CPU Architecture | ARMv9.2-A |
| CPU Cores | 40 cores |
| CPU Details | 2x ARM GB10 CPU |
| Memory | |
| Capacity | 256 GB |
| Type | LPDDR5x |
| Bandwidth | 273 GB/s |
| Interface | 256-bit |
| Unified Memory | Coherent CPU-GPU |
| Performance | |
| Peak TFLOPS | 2.0 |
| Peak TOPS (AI) | 2.0K TOPS |
| FP4 Performance | 2.0K TOPS |
| Max Model Parameters | 405 billion |
| Storage | |
| Capacity | 8 TB NVMe M.2 2242 PCIe 5.0 x4 |
| Type | NVMe M.2 2242 PCIe 5.0 x4 |
| Networking & Connectivity | |
| SmartNIC | NVIDIA ConnectX-7 SmartNIC |
| NIC Bandwidth | 200 Gbps |
| Ethernet | 10GbE |
| WiFi | WiFi 7 (Gig+) |
| Bluetooth | Bluetooth 5.4 |
| USB Ports | 8x USB Type-C (4 per unit) |
| Physical Specifications | |
| Dimensions (W×D×H) | 150 × 150 × 51 mm |
| Weight | 2.96 kg |
| Power Supply | 480W |
| TDP | 360W |
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Release Information
| Release | Q2 2025 |
| Vendor | ASUS |
| OS | NVIDIA DGX OS |